![Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].](https://image.mono.ipros.com/public/product/image/60a/2001507807/IPROS3104238983121622376.png?w=280&h=280)
Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].
Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.
In-vehicle ECUs typically use metal cases made of aluminum or copper. While metal shielding ensures robustness and excellent EMC measures, it poses significant challenges in terms of weight and cost. With the electrification of vehicles, the imperative of "how to lighten the body and extend the driving range" is unavoidable, and the demand for lightweight solutions is high. Sekisui Techno Molding's approach enables weight reduction by converting from metal to resin (approximately 45% reduction for the same shape). It also allows for design freedom through resin molding and cost reduction via mass production. While many resin products are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, Sekisui Techno Molding's resin products ensure these functions. ■ Thermally conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design freedom, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design freedom, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.
- Company：積水テクノ成型 新事業開発部
- Price：Other
![Resinization of HMI, HUD, and clusters, reduction of component count [heat dissipation, EMC]](https://image.mono.ipros.com/public/product/image/2001640386/IPROS16725344234335861184.png?w=280&h=280)
